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金属中厚度检测方案(电镜部件)

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检测项目 理化分析

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Introduction When preparing a TEM lamella in focused ion beam (FIB), curtaining is a common obstacle. Curtaining is a roughness on the lamella as a result of non-uniform thinning which critically affects the quality of analytical data collected, in addition to the ability to image and thin the lamella. A common cause of curtaining is the presence of different materials with a range of milling rates. The solution we discuss here to reduce curtaining is to change the orientation in which a lamella is ion beam polished/thinned by using the rotation function of the OmniProbe 400 nanomanipulator.

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IntroductionWhen preparing a TEM lamella in focused ion beam (FIB), curtaining is a common obstacle. Curtaining is aroughness on the lamella as a result of non-uniform thinning which critically affects the quality of analytical datacollected, in addition to the ability to image and thin the lamella. A common cause of curtaining is the presence ofdifferent materials with a range of milling rates. The solution we discuss here to reduce curtaining is to change theorientation in which a lamella is ion beam polished/thinned by using the rotation function of the OmniProbe 400nanomanipulator.

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牛津仪器科技(上海)有限公司为您提供《金属中厚度检测方案(电镜部件)》,该方案主要用于其他中理化分析检测,参考标准《暂无》,《金属中厚度检测方案(电镜部件)》用到的仪器有聚焦离子束扫描电镜用纳米操纵手 牛津仪器Omniprobe。

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