冷镶材料的选择

VACUUM IMPREGNATION EQUIPMENT I 1. Recommended when very small through-holes (<0.032" diameter) need to be filled 2. Should also be used with thick PCB’s (>6 layers) VACUUM IMPREGNATION EQUIPMENT I 3. Air is removed from hole so that edges from rounding 4. Epoxy mounting compounds perform the best under impregnation  Buehler’s Epoxide has proven to work the best  Acrylics such as SAMPL-KWICK do not work well in a vacuum  SAMPL-KWICK in fact, has a tendency to boil 1. Mounting compound is poured into mold in the vacuum The patented Vacuum Chamber  Pouring in the mold outside the vacuum and then placing it inside will not remove the bubbles No. 20-1382-160 VACUUM IMPREGNATION EQUIPMENT I, with high strength plastic vacuum chamber, built-in synchronous motor and rotating turn table, pouring mechanism, vacuum gauge and hose, filtering flask, glass tubing, rubber stopper, 100 graduated paper cups, 12 SAMPL-KUPS, 100 vacuum table liners, Drierite dehydrating agent and vacuum pump for 115V/60Hz/1 phase. No. 20-1382-250 VACUUM IMPREGNATION EQUIPMENT I, same as 20-1382-160 but for 220V/50Hz/1 phase operation.