SPI Supplies Plasma Prep™ RIE

The SPI Supplies Plasma Prep Reactive Ion Etcher (RIE) uses a chemically reactive anisotropic plasma to etch and remove materials from package devices, wafers, and other substrates where a directional field is needed. In failure analysis labs, the use of wet etching for these samples is not only dangerous, in many cases it causes undercutting due to the isotropy of the etch. The Plasma Prep Reactive Ion Etcher uses dry etching to create an anisotropic etch—meaning that the etch is uni-directional