资料摘要
资料下载Microelectronics, Part I: Cutting, Mounting Written by: Scott Holt,Applications Engineer,Buehler Editor:George Vander VoortDirector, Research and Technology, Buehler Introduction For most microelectronic devices and packages, direct microscopic observation of a cross section is an important means of inspecting a particular defect. The creation of a cross section, as a destructive measure, is often used in the microelectronics lab as a decisive and final inspection tool after all other economical means of nondestructive inspection are employed. In order to produce a cross section, many of the techniques used in the metals industry have been borrowed; to a large degree, with success. However, the philosophy and logic for choosing a particular method of cutting, mounting, and abrasive preparation has often been lost in the process. This is of extreme significance because the needs of the microelectronics industry vary greatly from those of the metals industry. Issues such as feature size, specific area cross sectioning, and the ability to prepare a variety of materials with different mechanical properties within a single plane of polish require an understanding of basic abrasive processes so that appropriate sectioning methods might be developed. This issue of TECH-NOTES is the first half of a two part effort to summarize some of the basic concepts involved in proper preparation of microelectronic materials. We will discuss some simple guidelines which the microelectronic materials analyst might draw upon in the development of better preparation techniques. In particular, this issue will cover the variables involved in cutting and mounting of microelectronic materials, and summarize some of the technique and consumable choices that must be considered in order to achieve quality results. The next microelectronics issue of TECH-NOTES will continue with the abrasive processes of grinding and polishing these materials.
AbrasiMet L Pro 产品手册
简介:AbrasiMet L Pro 专为严苛环境下的应用而设计,可选配 10in-16in 切割片,支持灵活的切割模式并且可以创建并保存切割程序,通过先进的方式为不同类型的试样提供一致且可重复的切割质量。
AbrasiMatic 300 砂轮切割机
简介:AbrasiMatic 300 是专为高工作强度实验室而设计的砂轮切割机。 作为台式切割机, 它具备 Z 轴手动、 Y 轴手动及自动等切割模式, 同时可选的 X 轴平台移动功能可轻松实现定位及序列切割。 AbrasiMatic 300 可灵活用于切割大多数材料、 尺寸和形状的样品。
IsoMet Low Speed 低速精密切割机
简介:IsoMet® Low Speed 是一款低速精密切割机, 专门用于切割多种材料, 并保证产生的变形最小。 其具有切割材料损耗小及可夹持不同大小形状试样的特点, 几乎适用于所有实验室材料, 包括脆韧性金属、 复合材料、 水泥、 塑料、 薄片、 电子和生物材料。
PetroThin 薄片切割机
简介:PetroThin®薄切片系统是一套精确且易于使用的设备,用于重新切片和减薄各种不同样品,比如岩石和矿物、陶瓷、混凝土、 骨头和牙齿,以实现材料的表征。
IsoMet 1000 精密切割机产品手册
简介:IsoMet 1000 精密切割机是一款完全封闭式的切割机, 为需求切割一致性和多功能性的客户而设计, 可搭配 4”-7”[102mm-178mm] 切割片以最小变形切割各种类型的材料。 夹具通用性这一特点能很好的夹持各种不同形状结构的样品, 帮助用户切割各种脆性或韧性的材料, 包括金属、 复合材料、 水泥、 薄片、 塑料、 电子和生物材料等。
相关产品
洛氏硬度计 RH2150 | 美国威尔逊硬度计 Wilson
美国标乐 Buehler | SimpliVac 真空镶嵌机
美国标乐 Buehler | AbrasiMet M 手动砂轮切割机
Buehler AbrasiMet XL Pro™ 大型砂轮切割机
AutoMet™ 300 Pro 研磨抛光机
多功能硬度计 UH4000 | 美国威尔逊硬度计 Wilson
美国标乐 Buehler | AutoMet™ 250 研磨抛光机
美国标乐 Buehler | EcoMet 30 磨抛机
PlanarMet™ 300台式预磨机
MiniMet 1000 半自动磨抛机
美国标乐 Buehler | IsoMet HS 高速精密切割机
美国标乐 Buehler | SimpliMet 4000自动镶嵌机
全自动维氏/努氏硬度计 VH3300 | 美国威尔逊硬度计
DiaMet 硬度测试软件
IsoMet 1000精密切割机
关注
拨打电话
留言咨询