方案摘要
方案下载应用领域 | |
检测样本 | |
检测项目 | |
参考标准 |
VACUUM IMPREGNATION EQUIPMENT I 1. Recommended when very small through-holes (<0.032" diameter) need to be filled 2. Should also be used with thick PCB’s (>6 layers) VACUUM IMPREGNATION EQUIPMENT I 3. Air is removed from hole so that edges from rounding 4. Epoxy mounting compounds perform the best under impregnation Buehler’s Epoxide has proven to work the best Acrylics such as SAMPL-KWICK do not work well in a vacuum SAMPL-KWICK in fact, has a tendency to boil 1. Mounting compound is poured into mold in the vacuum The patented Vacuum Chamber Pouring in the mold outside the vacuum and then placing it inside will not remove the bubbles No. 20-1382-160 VACUUM IMPREGNATION EQUIPMENT I, with high strength plastic vacuum chamber, built-in synchronous motor and rotating turn table, pouring mechanism, vacuum gauge and hose, filtering flask, glass tubing, rubber stopper, 100 graduated paper cups, 12 SAMPL-KUPS, 100 vacuum table liners, Drierite dehydrating agent and vacuum pump for 115V/60Hz/1 phase. No. 20-1382-250 VACUUM IMPREGNATION EQUIPMENT I, same as 20-1382-160 but for 220V/50Hz/1 phase operation.
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