方案摘要
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The quantities of sulfuric acid and copper contained in CuSO4 plating solution can be determined consecutively by using the COM-potentiometric Titrator with additional burets and suitable electrodes. Sulfuric acid is titrated with sodium hydroxide titrant first. And then potassium iodide is added in the status acidified by sulfuric acid to liberate iodine. The free iodine is finally titrated with sodium thiosulfate titrant to measure copper contained.
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