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Abrasive solutions containing SiO2, H2O2, etc. are used as the silicon wafer abrasive solution which is used in semiconductor manufacture process. Abrasive effect is delivered with SiO2 as a mechanical abrasive and H2O2 as a chemical abrasive. Since H2O2 in abrasive solution gradually decreases in concentration during the abrasion process, its concentration needs to be measured regularly to replenish H2O2 as necessary. This section introduces an example in which H2O2 was quantified by oxidation-reduction titration using KMnO4 titrant. 5H2O2 + 2KMnO4 + 3H2SO4 K2SO4 + 2MnSO4 + 8H2O + 5O2
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