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Tin (Sn2+) in solder plating solution is quantified by oxidation-reduction titration with iodine. Solder plating solution contains Sn2+, Sn4+, Pb2+, acids, etc. Iodine works as an oxidant against Sn2+. Favorable results can be obtained when titration is conducted in carbon dioxide or nitrogen gas atmosphere since Sn2+ is oxidized easily by oxygen in air and becomes Sn4+.2Sn2+ + 2I2 2Sn4+ + 4IThis section introduces an example of titration with iodine titrant by adding the sample in carbon dioxide atmosphere which is generated by decomposition of sodium bicarbonate.
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