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世伦科技专业制造扫描电镜，并开电子束焊接机历史先河，于2005年研制了微纳米尺度的电子束焊接机，在学术会议上宣布这个新的概念后引起很大轰动。其应用领域广泛，尤其在亚微米焊接需求方面，更加显示其意义重大。
§ E-beam Micro Joining with surface cleanness
§ Quality welding of metal with high reflexibility Ag, Cu, etc.
§ Metal with high melting point W, Ti etc
§ Fine and complicated structure SOS (System on Chip), Precision Valve
§ Wetting/Joining for Gas Sensor
§ Precision parts welding for Aircraft, Automobile industry, Aerospace and Power Engineering.
技术参数：
Cathode Type Tungsten Hair pin type
HV Power Supply Source Vacc. : ~35KeV(Max.)
Probe beam Current A few pA ~ 35uA
(Ultra High Current Density) 50uA (Max. Performance)
Neutralizer Plate Thermal Electron Ground
Faraday Cage & Meter: ~ Micro Ampere
Magnetic Lens System Condenser & Objective
Scan System 3 types of Scan mode
Detector BSE Detector
Vacuum System R.P(2) + TMP
Manual & Auto Control
Stage Micro Stage
主要特点：
FEATURES
§ Low Power & High Performance
§ fast response system for preventing weld
§ defects due to gun discharges,
§ high weld quality and welding process repeatability, possibility of gun mounting on a robotic manipulator.
§ Max. 35KeV Voltage Power
§ Max. 50㎂ Beam Current
§ Novel Seam Tracking for NANO Size
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