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4300FP - Semi-automatic Wafer Bump Testing
The Nordson DAGE 4300FP eliminates manual handling of expensive wafers. It improves cleanliness through isolation of bondtester and wafer handler and increases productivity through semi-automatic testing.
Shear testing using Nordson DAGE's patented air bearing frictionless intelligent load cell system
Fully automatic wafer handling via customer's third party robot handler (SMIF/FOUP) equipment
Wafer handler and bondtester can operate in isolated environment with minimum operator interaction
Joystick manipulation of 100% of wafer surface under test head without repositioning of wafer
Semi-automatic test routines using 2 reference points (no camera system required) per wafer enable bondtesting to the entire wafer surface without repositioning
460mm x 300mm XY stage with robot compatible chuck. Pneumatically operated pins allow wafer exchange using a robot handler
360 degree load tool rotation - optional
Automatic calibration and linearity checks
Integrated analysis including statistics and SPC functions
ODBC compliant
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