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IC/半导体/LED封装检测解决方案
WB&DB焊线AOI检测设备
型号：F241/F251
主要特征 ：
1. 可选的5面和6面检查
2. 2.5D深度技术
3. 模块化且灵活
4. 64位操作系统
5. 至强处理器
6. 吞吐量从20,000上升到50,000上升
7. 相机分辨率范围从75 fps时的5百万像素到66fps时的12百万像素
应用范围：
1. 晶圆切割后进行检查以检测表面缺陷。
2. 封装分离后进行检查，以检测封装，标记，引线和电镀缺陷。
TTVISION自动光学检测设备的检测方式
*2D
*2.5D
*True 3D (Z5D)
F251
Wirebond AOI Machine
Features
3D Profiling Technology
Inspects Wrebond, Die & Epoxy Defects
Inspects Gold. Aluminum. Copper and Silver Wires
Measures Boll. Wedge. Stitch and Loop Parameters
Minimum Overki & UnderWI
Modular end Scalable Design
Cost Effective
high Throughput
F241
AOI Standard Configuration
Modular Design for Max Flexibility
Standardized Platform
Common Spare Parts
2D AOI技术规格 | |
·Onload /Offload | |
Number of Magazines | 2-7 units |
Substrate Size | 30(W) x 150(L) - 200(W) x 300(L)mm |
Handling | |
Camera Indexing | High Speed Servo driven XY Gantry |
Substrate Indexing | Mi cro-Step Step per d riven Conveyor |
·Inspection Hardware | |
Camera Resolution | 12MP Color |
Lighting | Multi Channel LED |
Optics | Low Distortion Macro Lens |
Controller | PC-based |
·Software | |
Inspection Software | TTVISION © |
·Operating System | MS Windows 64 bit OS |
·Reject Handling | |
Electronic Mapping | |
Defect Classification | 99 Categories |
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