Fei Hui is a postdoctoral fellow at Technion-Israel Institute of Technology, Dr. Hui got her PhD degrees in Nanoscience at the University of Barcelona and in Chemistry at Soochow University in 2018. During her PhD, she visited at the Massachusetts Institute of Technology (MIT, USA) for 12 months and the University of Cambridge (UK) for 6 months. She has published over 40 research papers, 12 of them are as first author, including Nature Electronics, Advanced Functional Materials, ACS Applied Materials and Interfaces, among others. Moreover, Dr. Hui edited one book chapter on CAFM for Wiley-VCH, and applied for two international patents. She has received the 2019 Park AFM Scholarship, the Mobility Grant of the Royal Society of Chemistry etc. She is an active member of several technical and organizing committees of top international conferences in the field of electronic materials and devices, such as IEEE-IPRS (2020), IEEE-IIRW (2020) and IEEE-IPFA (2019, 2020).