牛津OXFORD Lab-X 配件 51-760

CMI760 PCB Thru-hole and Surface Cu System

The CMI760 is a benchtop system offering complete solutions for the PCB industry. The instrument can measure the thickness of surface copper – including copper foil, laminated copper, traces and pads – as well as the thickness of plated thru-hole copper. Used at incoming inspection, at the production line, or in final QC, the CMI760 provides precise results utilizing advanced micro resistance and eddy current technologies. The standard surface copper probe features a user-replaceable tip to reduce costs and minimize downtime. The illuminated, clear tip casing allows for easy placement on narrow traces. The optional plated thru-hole probe features automatic temperature compensation so it can test prior to and after etching, and works on double-sided and multilayer boards, even through tin and tin/lead resist.