方案摘要
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Abstract Improving integrated circuit (IC) performance generally requires increased power density, thus generating more heat. Die attach materials are often the critical limiting item in the heat flow path out of the IC package. Polymeric adhesives, particularly silver filled epoxies, are the most commonly used die attach adhesives because of their low processing temperatures and ease of use. However, silver filled epoxies have poor thermal conductivities and are unsuitable for many of the next generation of ICs. Solder provides the next higher level of thermal conductivity, but presents significant challenges for cost sensitive, high volume commercial IC products.
热分析科学思维方法应用
石英晶体微天平在壳聚糖/瓜尔胶研究领域的应用
导热仪应用及研究
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