仪器对比
关注
MASTER workstations - Precision and Versatility
MASTER series workstations offer cutting- edge laser micromachining capabilities for unlimited range of materials. MASTER workstations are used for scientific research and industrial process development. Applications range from silicon ablation for solar cells to metal drilling for diesel nozzles and patterning of extra hard materials.
Key features:
Micron precision laser material processing
High energy Pico or Femto second pulse lasers
Wavelength range from infrared to ultraviolet
Wide range of laser, mechanics and optics options
Professional software for laser micromachining and system control
Vibration-isolated granite platform in stand alone Class 1 laser safety body
Speed and spatial precision
Precision of laser micro machining is achieved by ultra-short laser pulses, precision of positioning stages and state of the art optics. In MASTER series workstations pico second or femto second laser pulses cause minimal heat-affected zone and maximize spatial precision. High pulse repetition rate and adequate pulse energy ensure fast material removal during ablation or drilling. Options of three different working wavelengths and combination of several wavelengths into a single beam offer enormous machining possibilities in terms of materials and processes. Accuracy of positioning Maximum firing accuracy and spatial resolution are achieved due to advanced beam delivery scheme.
Ultimate precision three-axis linear positioning stages for precise 3D ablation
Fast galvoscanner for high throughput.
Trepanning unit for advanced drilling.
Vibration-free Rigid vibration isolated granite platform in Class 1 laser-safe and clean-room compatible enclosure ensures robustness and reliability. Advanced control Designed specifically for laser micro machining, SCA software provides automatic control of MASTER workstation, easy design or import of patterns, flexible modification and simulation of micro machining process 
Applications Ablation 
Cutting and drilling 
Marking Surface Structuring
Clean and accurate modification of wettability characteristics of a wide range of engineering materials
Selective surface structuring for Antireflection
Lubrication modification of 2D and 3D objects
Surface & intravolume marking of transparent materials
Flexible production of Identification & anti counterfeiting marks
Flexible production of Micromechanics components
Cutting and drilling of saphire and other crystal materials
High-aspect-ratio holes for injectors
Filter production
Manufacturing of high aspect Micromolds from conductive and non-conductive materials using multiple 2D process
Production of high-aspect ratio micro-channels fo Microfluidics
Structuring high density circuit boards for thin films electronics
Positioning system
XY axis Travel X,Y 200 mm Maximum travel speed 2000 mm/s Maximum linear acceleration 30 m/s2 (no load) Accuracy ± 1 μm or better Repeatability 0.10 μm or better Z axis Travel Z 100 mm Maximum travel speed 400 mm/s Maximum linear acceleration 30 m/s2 (no load) Accuracy ± 1 μm or better Repeatability 0.10 μm or better (*Wide range of choice for all parameters)
Optics
Spot size (optics and wavelength dependent) down to 3 μm Output beam single- or multi-wavelength Control
System control Industrial type control computer LCD display and keyboard SCA software running on MS Windows OS Laser and motion synchronization Laser pulse synchronized output Physical Characteristics
Dimensions (approx.), W×D×H 1300×1200×1700 mm Power requirements, maximum 4500 W (* Dimensions can be adjusted during design of ordered workstation)
Laser options
Laser Wavelength and power Pulse energy Pulse duration Repetition rate Beam quality Picosecond laser 16 W @ 1064 nm >8 W @ 532 nm >4 W @ 355 nm >160 μJ @ 1064 nm <10 ps Single shot to 500 kHz M2< 1.5 Femtosecond laser 5 W @ 1028 nm 1mJ < 200 fs Single shot to 200 kHz M2<1.2 Customization options
Digital vision system for process control
Dual axis galvo-scanner for complex high speed beam process
Optical setup for helical drilling with predefined taper
Rotary and tilt axes for increased machining freedom for complicated structures
Several wavelengths combined in one system (1064 nm, 532 nm and/or 355 nm)
Holders and vacuum chuck for objects
In-built filter system for collection of airborne particles from material processing
Harmonics generator for 2nd, 3rd and 4th harmonics (for femto-Master workstation)
相关产品
