报价 ¥38万 - 60万
The AS-Premium double side heating has been developed for annealing compound semiconductor wafers using silicon carbide coated susceptors.
Rapid Thermal Annealing (RTA)
Implant annealing
Contact annealing (III-V and SiC)
Rapid Thermal Oxidation (RTO)
Rapid Thermal Nitridation (RTN)
Annealing of piezoelectric and pyroelectric materials
Getter activation
Rapid Thermal Evaporation (RTE)
Selenization (CIGS solar cells)
Sol-gel densification and crystallization
Etc.
The AS-Premium reactor with the loadlock and turbo pumps provide oxygen free environment for silicon smoothening and other oxygen sensitive processes.
The Annealsys AS-Premium system can process samples up to 150 mm diameter or 156x156 mm² .
The reactor platform and the machine have been designed to accommodate a wide range of configurations to meet customers’ requirements in terms of process.
The chamber can receive a single side or a double side lamp heating furnace. The design of the process chamber allows manual loading and the connection to a cluster tool or a glove box (options).
Pyrometer and thermocouple temperature control are standard features. The fast digital PID temperature controller provides high temperature reproducibility.
Graphite and silicon carbide coated graphite susceptors are available for processing of samples with encapsulati
RTP-300快速退火炉为法国annealsys公司生产,分为RTP-100, RTP-150, RSO-200,VPO-300共四个型号,分别对应4英寸、6英寸、8英寸、12英寸的真空快速退火炉产品。
技术规格:
- 最高温度:1200摄氏度;
- 升温速率:150摄氏度/秒;
- 降温速度:200摄氏度/分钟 (1000摄氏度-->400摄氏度);
- 温控均匀性:≤ 1.5%设定温度;
- 加热方式:红外卤素灯,顶部及底部加热;
- 灯管数量及功率:18支/20千瓦(RTP-100),24支/21千瓦(RTP-150);
- 腔体冷却:水冷方式;
- 衬底冷却:氮气吹扫;
- 工艺气路:MFC控制,最多4路 (氮气、氩气、氧气、氢氮混合气等);
- 主机尺寸及重量:505mm x 504mm x 420mm (W x D x H),约55Kg;
仪器特点:
- 真空快速退火炉,有低真空型号(10-3 hPa)、高真空型号(10-6 hPa);
- 可在不同气氛环境下使用,如惰性气体、氧气、氢氮混合气等;
- 控制方式:SIMATIC, SPS人机界面控制,7英寸触摸屏;
- 可存储50个程序,每个程序最多分为50段控制;
- 全自动智能控制,包括温度、时间、气体流量、真空度、循环水均可自动设置;
- 优异的温控均匀性,极佳的工艺重现性;
- 小尺寸台式设计;
应用领域:
- 离子注入/接触退火;
- 快速热处理(RTP),快速退火(RTA),快速热氧化(RTO),快速热氮化(RTN);
- 可在真空、惰性气氛、氧气、氢气、混合气等不同环境下使用;
- SiAu, SiAl, SiMo合金化;
- 低介电材料;
- 晶体化,致密化;
- 太阳能电池片键合;
等等...
参考客户:
西安交通大学、西安电子科技大学、中国科技大学、江汉大学、中科院上海技术物理所、中科院苏州纳米所、北京航天仪器研究所、京东方、武汉光迅、能华微电子等。
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