肉嫩度仪

Agilent 4100/4200 系列 MP-AES 仪器可与一系列能够扩展仪器性能的安捷伦附件和备件兼容，其中包括 Agilent OneNeb 第二代雾化器。OneNeb 第二代雾化器可为 MP-AES 仪器提供卓越的性能。基于分散流雾化技术的 OneNeb 第二代雾化器可提高灵敏度和容差，对溶解态固体具有更高的耐受性。此外，惰性构造使 OneNeb 成为一款通用雾化器，能够处理大多数 MP-AES 样品基质。 直接替代标准玻璃同心雾化器及其他具有 6 mm 外径喷嘴的惰性雾化器 适用于安捷伦 ICP-OES 和 MP-AES 系统 适用于传统玻璃旋流雾化室和惰性雾化室 — 可兼容具有 6 mm 外径喷嘴的雾化器。 提高灵敏度 — 由于分散流雾化技术能够生成极小颗粒气溶胶 高效 — 在常规和微量样品提升速率下均如此 对总溶解态固体 (TDS) 含量高的样品具有更强的耐受性 惰性构造 — 确保 OneNeb 能够处理大多数 MP-AES 样品基质

ICP-OES OneNeb 第二代雾化器安捷伦 ICP-OES 系列仪器可以与一系列能够扩展仪器性能的附件和备件兼容，其中包括 Agilent OneNeb 系列 2 雾化器。 OneNeb 系列 2 雾化器是一款通用型高效雾化器，坚固耐用的惰性高效雾化器，为 ICP-OES 仪器提供了卓越的性能。基于分散流雾化技术的 OneNeb 系列 2 雾化器可提高灵敏度和精密度并且对溶解态固体具有更高的耐受性。此外，惰性构造使 OneNeb 成为一款通用雾化器，能够处理大多数 ICP-OES 样品基质，包括强酸（如 HF）和常见的有机酸。特性— 直接替代标准玻璃同心雾化器及其他具有外径 6 mm 喷嘴的惰性雾化器— 适用于安捷伦 ICP-OES 和 MP-AES 系统以及 PerkinElmer Optima ICP-OES 系统— 适用于传统玻璃旋流雾化室和惰性雾化室 — 可兼容具有外径 6 mm 喷嘴的雾化器。— 提高灵敏度和精密度 — 由于分散流雾化技术能够生成极小颗粒气溶胶— 高效：在常规和微量样品提升速率下均如此 — 对总溶解态固体 (TDS) 含量高的样品具有更强的耐受性— 惰性构造：确保 OneNeb 能够处理大多数 ICP-OES 样品基质性能指标配置气动同心雾化器材质带有 PEEK 接头的高科技 ETFE 器身主体外径 6 mm，可兼容标准玻璃同心雾化器及其他惰性雾化器样品毛细管FEP 天然，外径 1/16 英寸 (1.6 mm)，内径 0.5 mm，长 750 mm。使用 PEEK 螺纹接头连接至雾化器。毛细管与接头组件可拆卸和更换雾化器气体连接器快速释放接头样品提升范围0.04–2.0 mL/min，能够分析体积有限的样品样品必须泵送至雾化器 — OneNeb 无法自动吸取兼容性直接替代标准玻璃同心雾化器及其他具有外径 6 mm 喷嘴的惰性雾化器适用于安捷伦 ICP-OES 和 MP-AES 系统以及 PerkinElmer Optima ICP-OES 系统适用于可兼容具有外径 6 mm 喷嘴的雾化器的传统玻璃旋流雾化室和惰性雾化室使用旋流雾化室获得最优性能典型应用酸性溶液，包括 HF 消解液在有机溶剂中制备的样品体积有限的样品需要采用较低的溶液提升速率高 TDS 样品（总溶解态固体含量最高可达 25%）大粒径样品（直径可高达 150 μm）— 高灵敏度OneNeb 系列 2 雾化器采用的分散流技术可形成粒径分布很窄的极小颗粒气溶胶，其中大多数液滴的粒径小于 10 μm。大量小液滴确保样品传输效率更高。这一效率能够将灵敏度提高 2–15 倍（取决于用于比较的雾化器类型），即使在较低的样品提升速率下也是如此。— 优异的分析精度和低检测限较小的液滴在等离子体中去溶剂化和激发效率更高，确保使用 OneNeb 系列 2 雾化器获得的典型精密度为 RSD 小于 1%。OneNeb 系列 2 雾化器具有更高的样品传输效率，可提高分析灵敏度，这意味着您还可以获得改善的（更低的）检测限。— 高总溶解态固体 (TDS) 耐受度OneNeb 系列 2 雾化器可提高对具有更高 TDS 含量的样品的耐受性，因此您可以轻松运行可能堵塞常规雾化器的样品。例如，经常发现河口水、卤水、精细化学品或其中存在悬浮颗粒物的废油样品中的 TDS 含量高达 25%。— 极佳的长期稳定性OneNeb 系列 2 雾化器在长期测量中具有极佳的稳定性和出色的耐化学腐蚀性，并且对样品中更高的 TDS 含量具有极强的耐受性。— 快速冲洗与运行高 TDS 样品所需的一些雾化器不同，OneNeb 可提供最快的洗脱特性。这意味着只需更短的冲洗时间，可提高样品通量并降低产生记忆效应的几率。— 灵活在您需要改变应用时，OneNeb 系列 2 雾化器可消除在不同雾化器之间进行切换的麻烦和延迟。利用 OneNeb 系列 2 雾化器，您无需将用于测量常规样品的雾化器换为用于测量体积有限的样品的微流雾化器。或换为运行含高浓度 TDS 的样品的“高固体含量”雾化器。或换为测量强酸消化液前处理样品的惰性雾化器。OneNeb 系列 2 雾化器甚至可以在各种溶液流速下运行，并且不会影响灵敏度。— 惰性聚合物构造（带有 PEEK 接头的 ETFE 器身）确保 OneNeb 系列 2 适用于几乎任何样品。包括石化行业使用的常见有机溶剂和以王水、氢氟酸 (HF) 或 4 种酸消解物 (HClO4 - HCl - HNO3 - HF)进行前处理的地化熔融物中的样品消化液。— 稳定另外，OneNeb 系列 2 雾化器结构坚固，如果意外跌落或与其他部件碰撞，几乎不存在损坏风险。与常规的玻璃同心雾化器不同，它仍将完好无损，并持续提供出色的性能。— 简单且易于使用OneNeb 系列 2 雾化器直接与大部分常规的玻璃旋流雾化室和惰性雾化室兼容。OneNeb 系列 2 可轻松替代现有的玻璃同心雾化器。无需进行其他的方法改变。— 维护少OneNeb 系列 2 的操作类似于常规雾化器。只需在分析完成时用清洗液冲洗并定期清洗即可。

Components for DUV-photolithography资料下载：Download Components for DUV-photolithography Datasheet (PDF, 388 KB)One of the essential requirements of modern optoelectronics consists in miniaturization of equipment and devices as well as the components they include. It dictates the necessity of utilization of DUV lasers as the key tools of advanced photolithographic technology. This type of lasers have shortest (among others laser sources) wavelength of powerful monochromatic radiation. It allows generating nano-scale structures and thus creating systems characterized by the maximal spatial resolution as well as by packing density. Modern projection steppers and scanners on the base of KrF excimer lasers (248 nm) are currently used to produce lines in the 110 nm range. Lines as thin as 65 nm are being resolved by systems utilizing ArF excimer lasers emitting light with a wavelength of 193 nm. Further resolution enhancement and improvement of the systems became possible using immersion lithography. In this case laser radiation is focused not on dry substrate but on the one moistened by special immersion liquid. This liquid is typically ultra-pure, deionized water continually circulated to eliminate thermally-induced distortions. Such approach has allowed increasing the numerical aperture by more than 30% and as a result it enables the economical volume production of microchips featuring 45 nm structures.Utilization of synthetic crystal quartz for the purposes DUV-photolithography is caused by its excellent transmission in UV range, high crystallographic perfection and optical homogeneity, chemical resistance and stability to intensive laser radiation.For production of optical components described in this chapter Tydex uses synthetic crystal quartz of precision optical grade (class A1, category “extra”).Main parameters of the used material are as follow:ParameterValueTwinnings, striaes, microbubbles including their conglomerates inclusions and cracksnot allowedPolarization uniformityno visible variations during inspection between crossed polarizersHomogeneity of refractive indexΔ n 3 x 10-6 (TWD = λ /10 per inch of crystal length)Etch channels, cm-2= 30, typicallyAbsorption coefficient, cm-1 (λ=193 nm)= 0.025Birefringence, nm/cm= 10Concentration of main impurities, ppm= 10circular plano-plano thin plates (wafers) For DUV-photolithography Tydex supplies the following components:High level of growth technology which is currently used to produce synthetic crystal quartz does ensure that these parameters will be obtained. But high-involved responsibility induced by application dictates a mandatory requirement to check material quality additionally. Moreover any small piece of used material must be tested without exceptions and with double attention to any details. For this purpose prior to passing an ingot to production we cut and prepare a sample of required overall dimensions and then get it polished. After that we accurately test it under UV excitation using ArF excimer laser. Each ingot (i.e. the sample) even being grown at the same growth run must pass this test successfully. A dose and duration of the excitation simulate the further working conditions of finished optical components and are specially selected to make an attempt to discover material imperfections, mainly the impurities. Only the material withstanding the applied exposure and that is the most important thing – do not get UV-induced degradation of transmission, is passed to production. Otherwise or in case if any single parameter does not meet the above mentioned value, the material is unambiguously rejected and it is ensured that it will be never used for the purposes of discussed application.sector-shape plano-plano plates (sectors) wedge plates of complex design (depolarizers).Severe application' conditions where the components are used dictate the exclusive requirements to parameters of their treatment. Typical specification is as follows:ParameterValueOrientation tolerance, arc. min.+/- 10Surface quality, scr/digHigh-quality polishing, better than 20/10Surface roughness at any square of 350 μm x 260 μm (RMS), nm 0.6TWD ( λ= 633 nm), λ 1Thickness of an element, mm: - wafer - sector - depolarizer (thin edge)0.55575 1.9456 0.9Tolerance zone for overall dimensions (excluding thickness), mm+/-0.05Tolerance zone for thickness (typical value), μm+0.5/-2 (+/-0.5 – state-of-the-art)Non-parallelism of opposite surfaces (for plano-plano elements), arc. sec. 2Tolerance zone for wedge (for wedged elements), arc. min.+/- 25The examples of ZYGO interferograms (TWD) are shown at figures 1-3.Together with each component we supply a certificate of conformance as well as an individual interferometer graph demonstrating surface errors.Fig. 1 Typical ZYGO interferograms (TWD) of D100 mm wafer.Fig. 2 Typical ZYGO interferograms (TWD) of sector.Fig. 3 Typical ZYGO interferograms (TWD) of depolarizer. Besides the components mentioned above and upon your specification & design we will be glad to produce other custom-made components.