【原创】电极沉积设备及操作::Contact sputtering--devices and operation.

大陆

2008/04/07

私聊

常用设备综合讨论

说明：这里讲的是可以获得原子尺度接触的金属电极沉积设备Balzers Union SCD 040。和最简单的金属板或金属浆制备的电极相比，溅射沉积的电极具有更低的接触电阻和更小的分布电容。原始笔记是英文版，今天太晚，实在没功夫熬，有功夫的时候整理汉语版，并对图片作更多注解。

1. Sample preparation and placement
a)wrap the side face, avoiding metal sputtered on the side around.
b)remove the label "gold target". if the label indicate other materials you don't want, change the target!
c)close the chamber.

2. Environment being ready.
a)water Ruecklauf->vorlauf->(0-1)->press stoerung quitieren.
b)Ar gas (fore valve->turn from red to green)->black down valve counterclockwisely turning to open->tune first fore valve of main machine a little bit.
c)power on the sputtering machine by switching the button at the left side of the machine.
d)insert the plug of pump.

3. Presetting of sputtering
a)wait for the vacuum untill below 0.1 mbar.
b)press "sputtering" button twice.
c)"stop" botton pressed.
d)"osg" button pressed.
e)power on the quartz mornitor.
f)set thickness. set switch on(right move)->unit setting by rotating the right-bottom botton->tuning the scale to what you want by screwing the mut near the set switch->close the set switch(left move)->set density of the target installed, such as 193g/cc for gold.
g)zero by rotating the zero button on your top-right side.
h)start thickness measurement(white switch up).
i)tuning the fine valve until air pressure down to 0.07 mbar.
j)set current. "tension" button pressed->hold "up" button about 10 sec->tune "up" button stepwisely up to 35.
k)press green "start" button.
l)rotate the switch on the chamble to remove the target shield.

4. Sputtering process going on
a)observe the plasma state. if the plasma goes abnormal, close the sputtering machine and fix the problem.
b)keep current to 35 bu pressing "up" and "down".
c)wait.

5. Finishing work.
a)quartz mornitor will close automatically. if not, power it off.
b)rotate the switch on the chamble to reload the target shield.
c)close Ar gas: rotate vorvalve from green to red.
d)power off the sputtering machine.
e)close the pump by ejecting pump plug.
f)close the recycling water. vorlauf->ruecklauf->1-0.
g)take out the sample and clean the chamber, if the other side of the sample restart the process from the first step; if not, make everything in order then lock the door and leave.