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【作者】：LU CHUN-AN,LIN PANG,LIN HONG-CHING, WANG SEA-FUE

【题名】：Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste

【期刊】：Jpn J Appl Phys

【年、卷、期、起止页码】：VOL.45;NO.9A;PAGE.6987-6992(2006)

【全文链接】：http://jjap.jsap.jp/cgi-bin/getarticle?magazine=JJAP&volume=45&page=6987