XPS实验中的溅射速度确定

In ADVANTAGE software, there is an option to set the Ion gun sputtering as AUTO meaning it will set the Ion gun sputtering area to be 5X the X-ray spot size.

Normally if no change of X-ray spot say 400um, then it means sputtering is 2mmx2mm.

I mentioned about this because if you change X-ray spot size > then sputtering area change > then sputtering rate change.

Next to know the sputtering rate, usually the most common way is to do a sputter depth profile experiment on a STANDARD sample (e.g. 100nm SiO2 on Si, or Ta2O5...etc). I think instrument vendors should do it for users on such reference sputtering rate checking when performing maintenance calibration on the instrument?

您讲的第一个问题，让我突然明白，原来我一直理解错误，感谢，呵呵。

第二问题，在操作界面上有一个溅射速度Ta2O5=0.51nm/s,如图所示，实验操作员解释说这是标样的溅射速度，并不是我的样品的溅射速度，是这样的么？如果是这样，那如何能知道我的样品（锆合金）的溅射速度呢？

Yes, the instrument user told you the truth. This sputtering rate is based on Ta2O5 not your sample.

Sputtering rate for each different material will be surely different and only way to know the TRUE sputtering rate on your sample is as if you have a standard known thickness of same material > then you try it out to sputter it through to determine the TRUE sputtering rate.

But as you know, it is almost impossible to have ALL standard with known thickness for ALL kinds of sample in real-life. So usually a common way to do is reference to some STANDARD material sputtering rate and at least it can serve as some "reference". So take your example, you could still use the sputtering rate of 0.51nm/min in the software menu you capture > and then calculate the depth. But if you are writing some paper or something you need to mention that you are referencing to a sputtering rate on Ta2O5.

如此看来，还是比较麻烦，不知是否有人做过这方面系统的测定，这应该可以制作出各种常用材料的一个标准表，但这个工作可能比较繁琐。
谢谢。