Ekspla FemtoLux30型飞秒激光器

Ekspla FemtoLux30型飞秒激光器

报价:¥30万 - 50万
型号: FemtoLux30
产地: 其他国家
品牌: Ekspla
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简介
FemtoLux 30是一款工业级飞秒激光器,提供30 W的输出功率(1030 nm波长),具备高能量版本(1 mJ在10 kHz)。该激光器具有从<350 fs到1 ps的可调脉冲持续时间,可在单脉冲到4 MHz范围内工作,并且能够在多种模式下运行,包括MHz、GHz和MHz+GHz突发模式。其特点还包括小于0.5%的长期功率稳定性、小于1%的脉冲能量稳定性以及小于20 µrad/°C的光束指向热稳定性。此外,它采用创新的干式冷却系统,无需水冷却,降低了维护需求,提升了可靠性。适用于微加工应用,如玻璃、蓝宝石和陶瓷的微加工,以及微电子制造等。

FemtoLux 30

Industrial Femtosecond Laser
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datasheet
  • 30 W at 1030 nm, 11 W at 515 nm, 6 W at 343 nm

  • >90 µJ at 1030 nm, >55 µJ at 515 nm, >30 µJ at 343 nm

  • MHz, GHz, MHz+GHz burst modes

  • < 350 fs – 1 ps

  • Single shot to 4 MHz (AOM controlled)

  • Dry cooling (no water used)

Industrial Femtosecond Laser FemtoLux 30

Features & Applications

FEATURES

  • Typical max output power
    30 W at 1030 nm,
    11 W at 515 nm,
    6 W at 343 nm

  • >90 µJ at 1030 nm,
    >55 µJ at 515 nm,
    >30 µJ at 343 nm

  • High energy version available (1 mJ at 10 kHz)

  • MHz, GHz, MHz+GHz burst modes

  • >250 µJ in a burst mode

  • <350 fs – 1 ps

  • Single shot to 4 MHz (AOM controlled)

  • Pulse-on-demand (PoD), with jitter as low as 20 ns (peak-to-peak)

  • <0.5% RMS power long term stability over 100 hours

  • M² < 1.2

  • Beam circularity > 0.85

  • Zero maintenance

  • Dry cooling (no water used)

  • PSU and cooling unit integrated into single 4U rack housing

  • Easy and quick installation

  • Compatible with galvo and Polygon scanners as well as PSO controllers

  • 2 years of total warranty

APPLICATIONS

  • Glass, sapphire and ceramics micro processing

  • Microelectronics manufacturing

  • Glass intra volume structuring

  • Micro processing of different polymers and metals

  • LCD, LED, OLED drilling, cutting and repair

Description

A RELIABLE & VERSATILE TOOL FOR MICROMACHINING

Designed from the get-go for maximum reliability, seamless integration and non-stop 24/7/365 zero maintenance operation with innovative ”dry” cooling.

The FemtoLux 30 femtosecond laser has a tunable pulse duration from <350 fs to 1 ps and can operate in a broad AOM controlled range of pulse repetition rates from a single shot to 4 MHz.

The maximum pulse energy is more than 90 μJ operating with single pulses and can reach more than 250 µJ in burst mode, ensuring higher ablation rates and processing throughput for different materials.

The FemtoLux 30 beam parameters will meet the requirements of the most demanding materials and micro-machining applications.

Innovative laser control electronics ensure simple control of the FemtoLux 30 laser by external controllers that could run on different platforms, be it Windows, Linux or others using REST API commands.

This makes easy integration and reduces the time and human resources required to integrate this laser into any laser micromachining equipment.

SEAMLESS USER EXPERIENCE

  • Easy integration.
    Remote control using REST API commands via RS232 and LAN

  • Reduced integration time.
    Demo electronics is available for laser control programming in advance

  • Easy and quick installation.
    No water, fully disconnected laser head. Can be installed by the end-user.

  • Easy troubleshooting.
    Integrated detectors and constant system status logging.

  • No periodic maintenance required.

Innovative 'Dry' Cooling System

The FemtoLux 30 laser employs an innovative cooling system and sets new reliability standards among industrial femtosecond lasers. No additional bulky and heavy water chiller is needed.

The chiller requires periodic maintenance – cooling system draining and rinsing and water and particle filter replacement. Moreover, water leakage can cause damage to the laser head and other equipment. Instead of using water for transferring heat from a laser head, the FemtoLux 30 laser uses an innovative Direct Refrigerant Cooling method.

The refrigerant agent circulates from a PSU-integrated compressor and condenser, to a cooling plate via armored flexible lines.

The entire cooling circuit is permanently hermetically sealed and requires no maintenance.

DIRECT REFRIGERANT COOLING SYSTEM FEATURES

  • Military-grade reliability

  • Permanently hermetically sealed system >90,000 hour MTBF

  • No maintenance

  • High cooling efficiency

  • >45% lower power consumption compared to water cooling equipment

  • Compact and light

SIMPLE & RELIABLE COOLING PLATE ATTACHMENT

The cooling plate is detachable from the laser head for more convenient laser installation.

The laser cooling equipment is integrated with the laser power supply unit into a single 4U rack-mounted housing with a total weight of 15 kg.

EASY AND QUICK INSTALLATION

  • Detachable cooling plate

  • Integrated cooling equipment with the laser power supply

Specifications

ModelFemtoLux 30
MAIN SPECIFICATIONS
Central wavelength
    Fundamental1030 nm
    With second harmonic option515 nm
    With third harmonic option343 nm
Pulse Repetition Rate (PRR) 2)200 kHz – 4 MHz
Pulse repetition frequency (PRF) after frequency dividerPRF = PRR / N, N=1, 2, 3, … , 65000; single shot
Average output power
    At 1030 nm> 27 W (typical 30 W)
    At 515 nm> 11 W 3)
    At 343 nm> 6 W 3)
Pulse energy
    At 1030 nm> 90 µJ or 1 mJ 4)
    At 515 nm> 55 µJ 3)
    At 343 nm> 30 µJ 3)
Number of pulses in MHz burst 5)2 – 10
Total energy in burst mode> 250 µJ 6)
Power long term stability (Std. dev.) 7)< 0.5 %
Pulse energy stability (Std. dev.) 8)< 1 %
Pulse duration (FWHM)Tunable, < 350 fs 9) – 1 ps 10)
Beam qualityM2 < 1.2 (typical < 1.1)
Beam circularity, far field> 0.85
Beam divergence (full angle)< 1 mrad
Beam pointing thermal stability< 20 µrad/°C
Beam diameter (1/e2) at 20 cm distance from laser aperture at 1030 nm2.5 ± 0.4 mm
Triggering modeinternal / external
Pulse output controlfrequency divider, pulse picker, burst mode, packet triggering, power attenuation, pulse-on-demand 11)
Control interfacesRS232 / LAN
Length of the umbilical cord3 m, detachable
Laser head cooling typedry (direct refrigerant cooling through detachable cooling plate)
PHYSICAL CHARACTERISTICS
Laser head (W × L × H)429 × 569 × 130 mm
Power supply unit (W × L × H)449 × 376 × 177 mm
OPERATING REQUIREMENTS
Mains requirements100 – 240 V AC, single phase, 50/60 Hz
Operating ambient temperature18 – 27 °C
Relative humidity10 – 80 % (non-condensing)
Air contamination levelISO 9 (room air) or better
  1. Due to continuous improvement, all specifications are subject to change without notice. Parameters marked typical are not specifications. They are indications of typical performance and will vary with each unit we manufacture. All parameters are specified for a shortest pulse duration.

  2. When frequency divider is set to transmit every pulse. Fully controllable by integrated AOM.

  3. At 200 kHz.

  4. At 10 kHz, fixed pulse duration (for example 1 ps).

  5. Oscillator frequency ~50 MHz, ~20 ns separation between pulses.

  6. > 250 µJ in MHz burst mode or MHz+GHz burst mode at 100 kHz PRR. > 90 µJ energy in GHz burst mode.

  7. Over 100 h after warm-up under constant environmental conditions.

  8. Under constant environmental conditions.

  9. At PRR > 500 kHz. At PRR < 500 kHz shortest pulse duration is < 400 fs.

  10. Custom pulse duration by request. For example – fixed 50 fs available.

  11. Jitter < 20 ns. Trigger-to-pulse delay < 1 µs.


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