Allied超精密芯片铣抛机 X-PREP®

Allied超精密芯片铣抛机 X-PREP®

参考价:¥10万 - 30万
型号: X-PREP
产地: 美国
品牌: Allied
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产品详情

The X-Prep® is a specialized 5-axis CNC-based milling/grinding/polishing machine designed to support electrical and physical failure analysis techniques and other applications requiring high precision sample preparation.






















It features a wizard-based, user-friendly, intuitive interface that guides the operator through a screen sequence.  As each screen appears, instruction is provided to the operator, ensuring every parameter and function is defined before operation.  Help  buttons on each screen provide access to additional explanation and instruction.  
A high-definition (720p) color camera projects a magnified, razor-sharp image of the sample onto the touch screen to help the operator define the X/Y milling/grinding/polishing boundary.  
Automatic tilt adjustment levels the sample plane parallel to the X/Y plane of the cutting tool.  Unevenly mounted or tilted samples can easily be leveled using this functionality.
A variety of fixtures and accessories are available to accommodate various sample types and sizes.


FEATURES

Easy-to-use, wizard-based workflow guides the operator through system setup to define: X/Y/Z milling position; X/Y milling rate; Z-force; Z-increment; milling pattern/tool path; tool overlap and more
Three (3) modes of control: Position (Milling/Grinding); Position Force (Grinding/Polishing); Floating Force (Polishing)
Optional 3D Software Module adds functionality/capability that includes: automatic 3D mapping/profiling; convex & concave profile deprocessing; and Excel® profile visualization/profile manipulation macro
Requires no G-coding or programming knowledge
Motorized tilt stage provides automatic, closed-loop 3-point leveling of the sample and custom leveling, 0.5 micron resolution
Live video navigation to define X/Y milling region
Closed-loop Z-axis positioning, 0.1 micron resolution, 1 micron accuracy
Closed-loop X/Y-axis positioning, 1 micron resolution
12" color LCD, touch-screen graphic user interface
Closed-loop Z-axis force control, 0.5 to 10 N
Universal tool collet uses 3 mm x 1.5" (38 mm) length tools (0.25 mm - 12 mm grinding/polishing tip)
100 x 100 mm milling region
Weight: 185 lb. (84 kg)
Dimensions: 21" W x 27" D x 25" H (533 x 686 x 622 mm)
Designed & manufactured by Allied in the USA
 Two (2) year warranty





似空科学仪器(上海)有限公司为您提供Allied超精密芯片铣抛机 X-PREP®,AlliedX-PREP产地为美国,属于进口抛光机、磨抛机、磨样机,除了Allied超精密芯片铣抛机 X-PREP®的参数、价格、型号、原理等信息外,还可为您提供JIACO等离子芯片开封机MIP,似空科仪客服电话400-860-5168转4452,售前、售后均可联系。

售后服务
  • 产品货期: 90天
  • 培训服务: 安装调试现场免费培训;提供付费培训
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似空科学仪器(上海)有限公司为您提供Allied超精密芯片铣抛机 X-PREP®,AlliedX-PREP产地为美国,属于进口抛光机、磨抛机、磨样机,除了Allied超精密芯片铣抛机 X-PREP®的参数、价格、型号、原理等信息外,还可为您提供JIACO等离子芯片开封机MIP,似空科仪客服电话400-860-5168转4452,售前、售后均可联系。
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