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- 1030
- 515
- 30W
- 11W
- 大于90微焦
FemtoLux 30
datasheet
30 W at 1030 nm, 11 W at 515 nm, 6 W at 343 nm
>90 µJ at 1030 nm, >55 µJ at 515 nm, >30 µJ at 343 nm
MHz, GHz, MHz+GHz burst modes
< 350 fs – 1 ps
Single shot to 4 MHz (AOM controlled)
Dry cooling (no water used)
Features & Applications
FEATURES
Typical max output power
30 W at 1030 nm,
11 W at 515 nm,
6 W at 343 nm>90 µJ at 1030 nm,
>55 µJ at 515 nm,
>30 µJ at 343 nmHigh energy version available (1 mJ at 10 kHz)
MHz, GHz, MHz+GHz burst modes
>250 µJ in a burst mode
<350 fs – 1 ps
Single shot to 4 MHz (AOM controlled)
Pulse-on-demand (PoD), with jitter as low as 20 ns (peak-to-peak)
<0.5% RMS power long term stability over 100 hours
M² < 1.2
Beam circularity > 0.85
Zero maintenance
Dry cooling (no water used)
PSU and cooling unit integrated into single 4U rack housing
Easy and quick installation
Compatible with galvo and Polygon scanners as well as PSO controllers
2 years of total warranty
APPLICATIONS
Glass, sapphire and ceramics micro processing
Microelectronics manufacturing
Glass intra volume structuring
Micro processing of different polymers and metals
LCD, LED, OLED drilling, cutting and repair
Description
A RELIABLE & VERSATILE TOOL FOR MICROMACHINING
Designed from the get-go for maximum reliability, seamless integration and non-stop 24/7/365 zero maintenance operation with innovative ”dry” cooling.
The FemtoLux 30 femtosecond laser has a tunable pulse duration from <350 fs to 1 ps and can operate in a broad AOM controlled range of pulse repetition rates from a single shot to 4 MHz.
The maximum pulse energy is more than 90 μJ operating with single pulses and can reach more than 250 µJ in burst mode, ensuring higher ablation rates and processing throughput for different materials.
The FemtoLux 30 beam parameters will meet the requirements of the most demanding materials and micro-machining applications.
Innovative laser control electronics ensure simple control of the FemtoLux 30 laser by external controllers that could run on different platforms, be it Windows, Linux or others using REST API commands.
This makes easy integration and reduces the time and human resources required to integrate this laser into any laser micromachining equipment.
SEAMLESS USER EXPERIENCE
Easy integration.
Remote control using REST API commands via RS232 and LANReduced integration time.
Demo electronics is available for laser control programming in advanceEasy and quick installation.
No water, fully disconnected laser head. Can be installed by the end-user.Easy troubleshooting.
Integrated detectors and constant system status logging.No periodic maintenance required.
Innovative 'Dry' Cooling System
The FemtoLux 30 laser employs an innovative cooling system and sets new reliability standards among industrial femtosecond lasers. No additional bulky and heavy water chiller is needed.
The chiller requires periodic maintenance – cooling system draining and rinsing and water and particle filter replacement. Moreover, water leakage can cause damage to the laser head and other equipment. Instead of using water for transferring heat from a laser head, the FemtoLux 30 laser uses an innovative Direct Refrigerant Cooling method.
The refrigerant agent circulates from a PSU-integrated compressor and condenser, to a cooling plate via armored flexible lines.
The entire cooling circuit is permanently hermetically sealed and requires no maintenance.
DIRECT REFRIGERANT COOLING SYSTEM FEATURES
Military-grade reliability
Permanently hermetically sealed system >90,000 hour MTBF
No maintenance
High cooling efficiency
>45% lower power consumption compared to water cooling equipment
Compact and light
SIMPLE & RELIABLE COOLING PLATE ATTACHMENT
The cooling plate is detachable from the laser head for more convenient laser installation.
The laser cooling equipment is integrated with the laser power supply unit into a single 4U rack-mounted housing with a total weight of 15 kg.
EASY AND QUICK INSTALLATION
Detachable cooling plate
Integrated cooling equipment with the laser power supply
Specifications
Due to continuous improvement, all specifications are subject to change without notice. Parameters marked typical are not specifications. They are indications of typical performance and will vary with each unit we manufacture. All parameters are specified for a shortest pulse duration.
When frequency divider is set to transmit every pulse. Fully controllable by integrated AOM.
At 200 kHz.
At 10 kHz, fixed pulse duration (for example 1 ps).
Oscillator frequency ~50 MHz, ~20 ns separation between pulses.
> 250 µJ in MHz burst mode or MHz+GHz burst mode at 100 kHz PRR. > 90 µJ energy in GHz burst mode.
Over 100 h after warm-up under constant environmental conditions.
Under constant environmental conditions.
At PRR > 500 kHz. At PRR < 500 kHz shortest pulse duration is < 400 fs.
Custom pulse duration by request. For example – fixed 50 fs available.
Jitter < 20 ns. Trigger-to-pulse delay < 1 µs.
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