焊锡液中的锡含量的测定 应用资料

智能文字提取功能测试中

焊锡液中的锡含量的测定 应用资料锡含量较低的焊料(Sn2+)用于防锈，锡含量超过49%的焊料用于焊接或微制造，如引线框架。低熔点焊料是锡(Sn2+)和铅(Pb2+)的合金。焊料中的铅可被其他金属取代，但锡(Sn2+)作为主要成分没有变化，其浓度分析在质量控制中很重要。在此应用中，我们通过氧化还原检测，其中二价锡(Sn2+)和碘(I2)反应并产生四价锡(Sn4+)。KGM KYOTO ELECTRONICSMANUFACTURING CO.，LTD.TIQ-97052enL Application MemoTin (Sn²) in Soldering Fluid Industry Inorganic chemical industry Instrument Automatic potentiometric titrator Measurement method Redox titration Standards GB/T 10574.1 1.Overview Solder with less tin (Sn) content is used for rust prevention， and solder with more than49% tin is used for spare soldering or micro fabrication such as lead frame. Low melting point solder is the alloy of tin (Sn") and lead (Pb). Lead in the solder is hasbeen replaced by other metals， but tin (Sn?) does not change as a major component， and theanalysis of its concentration is important in quality control1.. Here in this application， we demonstrate how the equivalent point is detected by redoxtitration where bivalent tin (Sn") and iodine (I2) react and produce quadrivalent tin (Sn+). 2. Apparatus Main unit Automatic potentiometric titrator (preamplifier STD) Electrode Platinum electrode Ceramic reference electrode (Internal solution： 3.33M potassium chloride) 3. Reagents Titrant 0.05mol/L iodine Solvent 6mol/L hydrochloric acid Potassium sodium tartrate (1g/6mL H2O) Sodium hydrogen carbonate (1g/20mL H2O) Sample Titer Concentration (mL) (mL) (g/L) 1 1.0 6.4656 38.37 2 1.0 6.4396 38.22 3 1.0 6.3529 37.70 Average 38.10 SD 0.35 RSD(%) 0.92 —Titration curve— Please feel free to contact us for any further information. Kyoto Electronics Manufacturing Co.， Ltd. Overseas Sales & Marketing Sect. 京都电子工业株式会社-可睦电子(上海)商贸有限公司 上海市徐汇区宜山路333号1201室 电话：021-54488867 电邮： kemu-kem@163.com 网址： http：//www.kem-china.com