【已应助】求文献2篇

sciencelinks没有提供全文的就不好找了。

http://bbs.instrument.com.cn/shtml/20100419/2507464/
序号】： 1
【作者】：KUTNEY MICHAEL C.(Applied Materials, Inc., Ca, Usa) MA SHAWMING

(Applied Materials, Inc., Ca, Usa) ZHAO ALLEN(Applied Materials, Inc., Ca,

Usa) DELGADINO GERARDO A.(Applied Materials, Inc., Ca, Usa) HOFFMAN DANIEL

J.(Applied Materials, Inc., Ca, Usa) HORIOKA KEIJA(Applied Materials, Inc.,

Ca, Usa) SINHA ASHOK(Applied Materials, Inc., Ca, Usa)
【题名】：Minimizing Plasma-Induced Charging Damage during Multi-Step Etching

of Dual-Damascene Trench and Via Structures
【期刊】：;Proc Int Symp Dry Process
【年、卷、期、起止页码】：VOL.5th;NO.;PAGE.339-340(2005)
【全文链接】：http://sciencelinks.jp/j-

east/article/200623/000020062306A0828446.php

http://direct.bl.uk/bld/PlaceOrder.do?UIN=184988104&ETOC=RN&from=searchengine


序号】： 2
【作者】：KUTNEY MICHAEL C.(Applied Materials, Inc., Ca, Usa) MA SHAWMING

(Applied Materials, Inc., Ca, Usa) HOFFMAN DANIEL J.(Applied Materials,

Inc., Ca, Usa) HORIOKA KEIJI(Applied Materials, Inc., Jpn)
【题名】：Reducing Plasma Non-Uniformity and Plasma-Induced Charging Damage by

Optimizing Etch Chamber Design
【期刊】：;Proc Int Symp Dry Process
【年、卷、期、起止页码】：VOL.6th;NO.;PAGE.211-212(2006)
【全文链接】：http://sciencelinks.jp/j-

east/article/200703/000020070307A0026115.php

http://direct.bl.uk/bld/OrderDetails.do?did=1&uin=202591539

更新了 british library direct,看看有没有tx有access的？谢谢

关键是找不到可下载链接

I have those two papers, please let me know your e-mail address.My e-mail address is shawmingma@gmail.com
/Shawming Ma