其他理化分析>形貌观察分析检测 | 微钻孔和数字图像相关技术（DIC）测量材料微尺度残余应力-北京欧兰科技发展有限公司

方案摘要

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应用领域	钢铁/金属
检测样本	其他
检测项目	理化分析>形貌观察分析
参考标准	暂无

采用LaVision公司DaVis7.2版DIC分析软件包，对Zr50Cu40Al10块体金属玻璃材料的扫描电镜图片进行分析，获得了形变，应变和残余应力的信息。

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配置单

LaVision StrainMaster材料应变形变成像测量系统
型号：StrainMaster

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方案详情

This paper reports a new technique, namely the
incremental micro-hole-drilling method (IμHD) for mapping
in-plane residual or applied stresses incrementally
as a function of depth at the micron-scale laterally and
the sub-micron scale depth-wise. Analogous to its
macroscale counterpart, it is applicable either to crystalline
or amorphous materials, but at the sub-micron scale.
Our method involves micro-hole milling using the
focused ion beam (FIB) of a dual beam FEGSEM/FIB
microscope. The resulting surface displacements are
recorded by digital image correlation of SEM images
recorded during milling. The displacement fields
recorded around the hole are used to reconstruct the
stress profile as a function of depth. In this way residual
stresses have been characterized around a drilled hole of
1.8microns. diameter, enabling the profiling of the stress
variation at the sub-micron scale to a depth of 1.8 microns.
The new method is used to determine the near surface stresses
in a (peened) surface-severe-plastically-deformed (S2PD)
Zr50Cu40Al10 (in atomic percent, at.%) bulk metallic glass
bar. In plane principal stresses of -800 MPa ± 90 MPa and
−600 MPa ± 90 MPa were measured, the maximum
compressive stress being oriented 15° to the axis of the bar.

上一篇在一个双稳湍流涡旋火焰中，对间歇性动态的时间-频率定位

下一篇一种通过数字图像相关（DIC）全场形变位移测量计算J积分参量的途径

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北京欧兰科技发展有限公司

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