仪器对比
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tSeries 300mm Sorters
300mm FOUP/FOSB carrier compatible·2 / 3 port inline or 4 / 6 port back to back
Industry standard SANKYO trackless dual yaw OEM robotics
Industry standard Sinfonia/TDK 300mm ports
optional BOLTS compliant open cassette adapters to allow 150mm and 200mm open cassette carriers
optional auto detect adapters for seamless 200mm OC to 300mm FOUP detection
Integrated RFID and E84 OHT delivery options
Sub class 1 particle performance
Smallest 300mm two port footprint available
Automation capable with SECSII/GEM/HSMS/GEM300
GUI based tools for easy recipe development
UPS power backup +vacuum reservoir.
sSeries 200mm SMIF Sorters
200mm 2 port SMIF carrier compatible·
Industry standard MOOG OEM robotics
Industry standard SMIF 200mm ports
Sub class 1 particle performance
Automation capable with SECSII/GEM/HSMS
GUI based RBuilder for easy recipe development
UPS power backup + vacuum reservoir
available with select Sorter+ options
nSeries OC Sorters
4 station open carrier wafer sorter
50mm to 200mm wafer sizes.
Dual paddle buffering for same carrier sorting
350wph OCR / 800wph transfer
smallest 4 station single level footprint available in industry
4 station for better queuing and larger on tool splits
Many concurrent wafer size options available
All sorter+ options can be added on this tool size
Optional AUTOTEACH
Sorter+
inspection and metrology options for wafer sorters
hologenix slip finder
addition of slipfinder hardware and software
wafer slip is detected and measured using propriety Hologenix lighting and software
typical usage in wafer manufacturing, SOI and EPI
recipes can scan outer wafer edge, center of wafer, both or entire wafer
wafer thickness measurements
AVG thickness / TTV / bow / warp
single center point or radial profiling
confocal laser or white light interferometer depending on application
function can be added to any typical sorting recipe
typical recipes bin wafer based on thickness
option for any system using OCR
measures scribe location against a qualified location
automated characterization
automated inspection
function can be added to any typical sorting recipe
includes GEM/SECS reporting for X/Y and linear offests
limits monitoring and alarms
Top and Bottom Bevel Inspection Option
bolt on application for NADA or PST sorters
inspection option which scans the wafer bevel for cracks and chips
standard ascii and SECS/GEM reporting with defect size and location
optional image capture and industry standard XY Report Formating
captures defects down to 0.5mm
function can be added to any typical sort recipe
lastest generation seeing defects down to 60um
flip option for wafer flip applications
180 degree for standard wafer flip
90 degree quartz carrier vertical loading
hologenix dimple detection
addition of dimple hardware and software
dimples are detected and measured using propriety Hologenix lighting and software
typical usage in Si wafer manufacturing and MEMS markets
whole wafer image processing or magnified version are available
optional stocker and AGV integrated E84 delivery
front side bright light inspection
bolt on application for NADA or PST sorters
wafer topside ONLY visual inspection
joystick control or programmable recipe control with pass/fail button
function can be added to any typical sorting recipe
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