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AZ 1500 HS family was developed in 1990. The background for this development was the fact that in making discrete and bipolar semiconductor devices wet-etching is still very common. For wet-etching adhesion is the most important issue. Especially on aluminium the mousebite-phenomenon is well known. To solve this problem we have chosen a low molecular weight novolak resin fraction resulting in significantly improved adhesion and also very high photospeed (therefore the suffix High Speed). Meanwhile AZ 1500 HS has proven its superior performance in several production lines and lead to less rework and higher yields.
AZ 1514 H is the safer solvent substitute for the well known AZ 1350 H which is now almost 25years old and intended for contact and proximity printing. For this application a low photospeed for better control of exposure (about 10s at 15 mW/cm2) and thus a forgiving resist is the best choice. For many years the "non safe solvent" counterparts AZ 111 S and AZ 1350 H have been the standard resists for making semiconductors, AZ 111 S for wet-etch of oxides, AZ 1350 H for aluminium and nitride etch.
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