电镀银溶液中银含量检测方案(自动电位滴定)

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KGM KYOTO ELECTRONICSMANUFACTURING CO.，LTD.TIQ-97063enL-KcMKYOTO ELECTRONICSMANUFACTURING CO.，LTD. Application MemoSilver in Silver Plating Solution Industry Inorganic chemical industryInstrument Automatic potentiometric titratorMeasurement methodPrecipitation titration 1. Overview After adding pure water and 15% sodium sulfide solution to the sample and heated， theprecipitate is filtered. Silver concentration in the precipitate dissolved in concentrated nitricacid and water is measured by titration with 0.1mol/L ammonium thiocyanate solution. Theendpoint is the maximum inflexion on the titration curve. The silver concentration iscalculated from the titration volume of the titrant. 2. Apparatus Main unit Automatic potentiometric titrator (preamplifier STD) Electrode Silver electrode Mercury sulfate reference electrode 3. Reagents Titrant 0.1mol/L ammonium thiocyanate solutionSolvent Pure waterIndicator 15%(w/v) sodium sulfide solution， Concentrated nitric acid 4. Example Sample Titer Conc. (mL) (mL) (g/L) 1 2 14.2680 30.79 5.014.2854 30.83 Average 30.81 -Titration curve- Please feel free to contact us for any further information. Kyoto Electronics Manufacturing Co.，Ltd. Overseas Sales & Marketing Sect. http：//www.kyoto-kem.com/en/contact/form.php 京都电子工业株式会社-可睦电子(上海)商贸有限公司电话： 021-54488867 电邮： kemu-kem@163.com 上海市徐汇区宜山路333号1201室 网址： http：//www.kem-china.com 电镀银溶液中银的含量测定 应用资料(英文版)在样品中加入纯水和15%的硫化钠溶液并加热后，过滤沉淀物。用0.1mol/L硫氰酸铵溶液滴定法测定溶解于浓硝酸和水中的沉淀物中的银的浓度。终点是滴定曲线上的最大拐点。银的浓度是由滴定液的滴定体积计算出来的。