【序号】：1 【作者】：T. Ko,A. Radisic, S. Armini, P. M. Vereecken, C.Drijbooms,H. Bender, S. P. Sun,C. Wann,C. H. Yu, P. Leunissen, W. Ruythooren,and S. Vanhaelemeersch 【题名】：The Role of Additives and Deposition Parameters in Cu Plating of High Aspect Ratio Vias 【期刊】：216th ECS Meetin，MA2009-02, October 4 - October 9, 2009 , Vienna, Austria 【年、卷、期、起止页码】：Abstract 2179 【全文链接】：http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=MAECES000902000026002179000001&idtype=cvips&gifs=yes
【序号】：2 【作者】：A. Radisic,O. Lühn,Jan Vaes, S. Armini, Z. El-Mekki, D. Radisic, W. Ruythooren, and P. M. Vereecken 【题名】：Copper Plating for 3D Interconnects 【期刊】：216th ECS Meetin，MA2009-02, October 4 - October 9, 2009 , Vienna, Austria 【年、卷、期、起止页码】：Abstract 2178 【全文链接】：http://scitation.aip.org/getabs/servlet/GetabsServlet?prog=normal&id=MAECES000902000026002178000001&idtype=cvips&gifs=yes
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