unht
第7楼2011/01/08
These applications include:
– measurement of bending of parts in MEMS such as cantilever beams or contactors in printed circuit
boards,
– bending of bond pads,
– measurement of Poisson’s ratio via four point bending and the anticlastic curvature method,
– membrane deformation,
– in-situ observation of deformation field during indentation,
– in-situ through-the-sample observation of deformation and crack formation during scratching on transparent materials.
水星
第8楼2011/01/08
这个有点陌生