仪器对比
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OAI的面板级掩模光刻机 Model 6020S,
用于FOPLP型号6020S -半自动化或自动化,实现500mm x 500mm晶圆尺寸的FO-PLP加工.
OAI’s Panel Level Mask Aligner for FOPLP Model 6020S - Semi or Automated
Enabling FO-PLP Processing at 500mm x 500mm Wafer Sizes
OAI掩模对准器，不同的印刷方式
距离: 间隙可设置在一个非常宽的范围内，增量精度1μM
软接触: •基材被带入非常柔软的机械接触曝光时的掩模。通过接触力可调软件设置
金属触点: •接触额外的氮气压力
真空接触: •真空级别控制接触力。真空度为由用户设置
OAI Mask Aligners
Various Printing Modes
PROXIMITY:
• THE GAP IS SETTABLE OVER A VERY WIDE RANGE WITH AN INCREMENTAL PRECISION OF 1μM
SOFT CONTACT:
• SUBSTRATE IS BROUGHT INTO VERY SOFT MECHANICAL CONTACT WITH THE MASK DURING EXPOSURE. THE CONTACT FORCE IS ADJUSTABLE VIA SOFTWARE SETTINGS
HARD CONTACT:
• CONTACT WITH ADDITIONAL N2 pressure VACUUM CONTACT:
• VACUUM LEVEL CONTROLS THE CONTACT FORCE. LEVEL OF VACUUM IS SET BY USER
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1年
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