SET 晶圆键合机 ACCμRA M ACCμRA 100 ACCμRA
报价 ¥1 - 9999
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Applications
• Laser diode, laser bar • VCSEL, photo diode
• LED
• Prisms, lenses, mirrors • Micro assembly
• Flip-chip bonding, die bonding
• Chip-to-chip, chip-to-substrate bonding
Specifications
• Accuracy* ±1 μm
•Post-bond accuracy: +/- 5 μm
•Range of force
Low force arm: 20 g to 1 kg
High force arm: 100 g to 20 kg
•Temperature up to 400°C
Independent heating for chip and substrate
•High resolution vertical movement
74 mm, resolution 0.01 μm Driven by linear motor
1年
是
有
免费
1年
免费维修零部件
2小时响应
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