【作者】:LU CHUN-AN,LIN PANG,LIN HONG-CHING, WANG SEA-FUE
【题名】:Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste
【期刊】:Jpn J Appl Phys Part 1
【年、卷、期、起止页码】:VOL.45;NO.9A;PAGE.6987-6992(2006)
【全文链接】:http://jjap.jsap.jp/cgi-bin/getarticle?magazine=JJAP&volume=45&page=6987