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【作者】:Salam, B. 【题名】:Solderability and reliability of printed electronics
【期刊】:Physical and Failure Analysis of Integrated Circuits, 2008. IPFA 2008. 15th International Symposium on the【年、卷、期、起止页码】:
【全文链接】:http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=4588211&url=http%3A%2F%2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D4588211
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第1楼2013/01/25
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