2006/691/EC In the Annex to Directive 2002/95/EC the following points 21 to 27 are added: ‘21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass. 22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems. 23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead frames. 24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors. 25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements; notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes. 26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps. 27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.’
2006/690/EC In the Annex to Directive 2002/95/EC the following point 29 is added: ‘29. Lead bound in crystal glass as defined in Annex I (Categories1, 2, 3 and 4) of Council Directive 69/493/EEC (*). ___________ (*) OJ L 326, 29.12.1969, p. 36. Directive as last amended by 2003 Act of Accession.’
2006/692/EC In the Annex to Directive 2002/95/EC the following point 28 is added: ‘28. Hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment).Exemption granted until 1 July 2007.’ 28、IT产品类的设备中,用于防腐和电磁屏蔽的无复层的金属板和紧固件的防腐涂层中六价铬豁免至2007.07.01。