【求助】(已应助)关于半导体硅的测试

给阁下两点提示：
1、要测试的全部内容一般即硅片制造商提供的规格参数，不妨使用silicon wafer, specifications或datasheet在网上搜一下，比如
Diameter     300 +/- 0.5 mm     300 +/- 0.2 mm
Type / Dopant     P/Boron     P/Boron
Orientation     <100> +/- 1º     <100> +/- 1º
Grade     Test     Prime
Resistivity     1 - 50 Ω-cm     15-20 Ω-cm
Radial Resisivity Gradient     —     As Specified
Oxygen     —     As Specified
Carbon     —     As Specified
Metals     < 5 x E10 atoms/cm2     < 1 x E10 atoms/cm2
Thickness     775 +/- 25 μm     775 +/- 15 μm
TTV(total thickness variation)     <= 5 μm     <= 2 μm
Bow / Warp     <= 50 μm     <= 40 μm
Site Flatness (STIR-site total indicator runout/readings) — As Specified
Notch     SEMI Standard     SEMI Standard
Particle Count     <= 50 @ >= 0.16 μm     <= 50 @ >= 0.12 to 0.065 μm
Front Surface     Polished     Polished
Back Surface     Polished     Polished
* N type wafers available

参考链接： http://www.svmi.com/diameter.aspx?id=7

2、如果对半导体行业还没有入门的话，我在这里提供一本手册供参考：

Handbook_of_Semiconductor_Interconnection_Technology.pdf