2002/95/EC 第7条修改如下： — Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead); 高温融化的焊料中的铅（即：铅含量≥85%的合金中的铅）；— lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunication,
用于服务器、存储器和存储系统的焊料交换、信号和传输，以及电信网络管理的网络基础设施设备中焊料中的铅；— lead in electronic ceramic parts (e.g. piezoelectronic devices). 电子陶瓷产品中的铅（例如：高压电子装置）.
2002/95/EC 第8条修改如下： Cadmium and its cmpounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (*) amendingDirective 76/769/EEC (**) relating to restrictions on the marketing and use of certain dangerous substances and preparations.
Lead used in compliant pin connector systems 顺应针联接系统中使用的铅
Lead as a coating material for the thermal conduction module c-ring 热导项枪钉模组(thermal conduction module c-ring)涂层中所用的铅
Lead and cadmium in optical and filter glass 光学玻璃及滤光玻璃中所用的铅及镉
lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
微处理器针脚及封装联接所使用的含有80-85%铅的复合（含有超过两种组分）焊料中的铅
lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages 倒装芯片(Flip chip)封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅
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2005年10月13日正式公报最新豁免项目（2005/717/EC）
Deca BDE in polymeric applications 十溴二苯醚在聚合物中的使用
lead in lead-bronze bearing shells and bushes 青铜轴瓦和衬套中的铅
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